NEDIS HSPA25I Heat Sink Paste 25g Injection

Heat Sink Paste 25 g Injection

Heat sink compound suitable for PCBs in transistors, for diodes, CPUs etc.
- Use it between -50 °C and 180 °C
- 25 g compound injection type.
- Color:White
- Thermal Conductivity :>3.2Watt/m-k
- Thermal Impedance:<0.06 degree C-in2/Watt
- Operation Temperture:-50~180 C

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